国产BGA红外线返修台T-862++专用红外线加热,穿透力强,器件受热均匀,可拆焊或返修BGA、SMD、CSP、LGA、QFP、PLCC和BGA植球,尤其是返修 BGA元件,适用拆焊15x15-35x35mm尺寸芯片元件。关于国产品牌 T862 电焊台详细产品介绍请点击图片或网址http://www.testeb.com/T862.html
国产品牌 T862 电焊台规格说明文档下载链接地址http://www.testeb.com/download/201501/20150116152200_838.pdf。(注)点击链接可直接阅读文档,或右键选择“另存为”保存到电脑。
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